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Equipment

株)Meca Tech Systems是相机模组测试器具领域专业性的基础和半导体，
显示器(FPD), 电机电子领域专业人员确保测试工程和模组生产全工程效果最大化为目的设备开发。

FPCB Bonder

  • Feature
    ㆍ中小型LCD Module的FOG & COG使用及Camera Module FPCB Bonding可能的应用
    ㆍCamera Module Monitoring & Vision Inspection的manual &Auto Align可能。
    ㆍ温度&压力的准确性及可靠性
    ㆍLoading Jig互换性& Tip平整度保证可能
    ㆍ高生产率和可靠性
    ㆍ合理的价格

    Specifications

    Application Device LCD FOG & COG, Camera Module FPC
    Lo/Unloading Method Manual & Auto Available(Magazine Type)
    Feeder Method(Seal Tape) Reel to Reel / Step Motor 驱动 & Manual 驱动
    Index Time 2sec/1ea
    UPH Optimization by customer request
    Control Unit PLC & PC Base (Touch Panel)
    Air Requirements 5kgf/㎠ (Clean Dry Air)
    Electric Requirements 220 VAC , Single Phase , 50Hz ~ 60Hz
    Dimension 900(W) x 900(D) x 1600(H)

Lens Protection Tape Attach

  • Feature
    ㆍ低像素，高像素Camera Module Align对应可能
    ㆍTray不用移动Tape粘接可能（工程减少）
    ㆍ从保护Tape Pitch和Tray Pitch之间移动距离设定可能
    ㆍModule Conversion可鞥
    ㆍ高生产率和可靠性
    ㆍ合理的价格

    Specifications

    Application Device Mobile Camera Module
    Lo/Unloading Method Manual & Auto Available(Soft Tray)
    Align Method Vibration Align or Magnetic Align (Tolerance ±1mm)
    Index Time 3sec/5ea
    UPH Optimization by customer request
    Control Unit PLC & PC Base (Touch Panel)
    Air Requirements 5kgf/㎠ (Clean Dry Air)
    Electric Requirements 220 VAC , Single Phase , 50Hz ~ 60Hz
    Dimension 900(W) x 900(D) x 1600(H)

Auto LED Test Handler

  • Feature
    ㆍIndex Turret方式实施的高生产率。
    ㆍDD Motor采用的各分割及正确的位置。
    ㆍData Base构建数据的分析可以Engineering
    ㆍVision的Marking检查功能
    ㆍ良品制材的Reel Tape包装可能
    ㆍ高生产率和可靠性
    ㆍ合理的价格

    Specifications

    Application Device Mobile Camera Module
    Lo/Unloading Method Bulk & Tube Type
    Unloading Method 256 Bins Sorting & Reel Tape
    Index Time Optimization by customer request
    UPH Optimization by customer request
    Control Unit PLC & PC Base (Touch Panel)
    Air Requirements 5kgf/㎠ (Clean Dry Air)
    Electric Requirements 220 VAC , Single Phase , 50Hz ~ 60Hz
    Dimension 1250(W) x 900(D) x 1650(H)

Auto Soldering System

  • Feature
    ㆍ低像素，高像素Camera Module Align对应可能
    ㆍTray不用移动Tape粘接可能（工程减少）
    ㆍ从保护Tape Pitch和Tray Pitch之间移动距离设定可能
    ㆍModule Conversion可能
    ㆍ高生产率和可靠性
    ㆍ合理的价格

    Specifications

    Application Device All Strip & Unit Device
    Lo/Unloading Method 5sec/1ea
    Index Time 2sec/1ea
    UPH Optimization by customer request
    Control Unit Embedded System (UI : Touch Panel & Teaching Pendent , JOG)
    X, ,Y,Z ,R - Axis 4轴 Robot＆Encoder适用
    Resolution (Robot / Wire) ±10㎛ / 0.1mm
    Air Requirements 5kgf/㎠ (Clean Dry Air)
    Electric Requirements 220 VAC , Single Phase , 50Hz ~ 60Hz
    Dimension 1000(W) x 1200(D) x 1600(H)
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